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A technology even more advanced than optical modules
CPO, a technology that deeply co-packages the optical engine with the switch chip, offers a solution for next-generation AI cluster interconnects by shortening the signal transmission path, reducing power consumption, and increasing bandwidth density. Traditional electrical interconnects and pluggable optical module technologies are approaching their performance limits when dealing with network speed demands of 800G, 1. It features a rectangular shape with two parallel rows of pins (typically ranging from 4 to 64 pins) that extend from both sides of the package, allowing. Optical modules, as the “couriers” that transmit data between devices in the network, bear the heavy responsibility of sending and receiving massive data for the “computing power highway,” making their importance increasingly prominent.